company with over 25 years of automated
soldering experience design and combine the latest in technology and
manufacture a complete line of high precision selective soldering, lead
component testing and steam aging equipment for the electronics and
board manufacturing and assembly.
soldering uses travelling flux and miniwave technology to apply a
amount of flux and solder to select through hole components
terminations on a
printed circuit board (PCB). RPS uses several types of XYZ axis
to articulate the soldering miniwave beneath the circuit board.
tinning describes the tinning or solder coating of SMT, throughhole and
form electronic components. A broad list of lead tinning applications
include solder coating, lead attach, solderability testing, and
dissolution of metallization testing.
Photon and Pulsar are proven industry platforms for the Steam Aging and
Dip & Look Solderability Test in accordance with IPC and MIL-spec
"Artificial Aging" Test done by the Photon provides additional testing
capability by aftificialy aging components by exposing them to 8 hours
of precision controlled temperature and steam.
"Dip & Look Test" is performed by the Pulsar which provides precise
handling of electronic components for the automated process of flux and
solder dip of component terminations.